LGA 3647

LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 ("Knights Landing"),[2] Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP/AP, and Cascade Lake-W microprocessors.[3]

LGA 3647
TypeLGA
Chip form factorsFlip-chip land grid array (FCLGA)
Contacts3647
FSB protocol
Processor dimensions76.0 mm × 56.5 mm
Processors
Predecessor
Memory supportDDR4
This article is part of the CPU socket series

The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for QPI, and 100G Omni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler’s pressure and its screws to secure it in place

Variants

There are two sub-versions of this socket with differences in the ILM (Independent Loading Mechanism), and the processor package carrier frame (square, and narrow) preventing mounting the other version's heatsink.

References
  1. wikichip.org
  2. Tom's Hardware: Intel Xeon Phi Knights Landing Now Shipping; Omni Path Update, Too. June 20, 2016
  3. Tom's Hardware: Skylake Xeon Platforms Spotted, Purley Makes A Quiet Splash At Computex. June 3, 2016
  4. Intel® Xeon® Processor Scalable Family Thermal Mechanical Specifications and Design Guide. December, 2019
  5. Intel® Xeon Phi™ Processor x200 Product Family Thermal/Mechanical Specification and Design Guide. June, 2017
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